Hacking DNA to make next-gen semiconductor materials
Published Date: 1/24/2024
Source: phys.org
Scientists at the U.S. Department of Energy's (DOE) Brookhaven National Laboratory, Columbia University, and Stony Brook University have developed a universal method for producing a wide variety of designed metallic and semiconductor 3D nanostructures—the potential base materials for next-generation semiconductor devices, neuromorphic computing, and advanced energy applications.