The last few decades have witnessed a tremendous advance in electronics technology, with the development of devices that are thinner, lightweight, flexible, and robust. However, as the devices get thinner so does the space for accommodating the internal working components. This has created an issue of improper heat dissipation in thin-film devices, since conventional heat sink materials are bulky and cannot be integrated into them. Thus, there is a need for thermal diffusion materials that are thin and flexible and can be implemented in thin-film devices for efficient heat dissipation.