Metallic microstructures are the key components in almost every current or emerging technology. For example, with the next wireless communication standard (6G) being established, the need for advanced components and especially antennas is unmet. The drive to yet higher frequencies and deeper integration goes hand in hand with miniaturization and fabrication technologies with on-chip capability. Via direct laser writing—an additive manufacturing technology that offers sub-micron precision and feature sizes—highly sophisticated and integrated components come into reach.